Design Capabilities

• Design up to 28 Layers
• High-Speed Differential Pairs
• Blind, Buried vias, Micro vias, and Via-in-Pad boards
• Minimum BGA pin-pitch: 0.4mm
• DDR/DDRII 800M/QDR/SRAM memory interface design
• Switch Power Supply
• High-speed high density large digital boards
• Backplane, Load Boards, Dut Cards
• Probe cards
• Analog, Mixed Signals, and RF Design
• Embedded Capacitance and Embedded Resistance
• Rigid PCB, Flexible PCB, and Rigid-Flex PCB designs